Help required please.

Could any explain the term "die components" used in electronics.

We have a stated requirement in a contract for MIL STAN 883B standards, however a supplied C of C states visually & inspected to MIL STAN 750 TM2010 B.

Is this the same/replacement or two different standards?

Thanks for your help

Help required please.

Could any explain the term "die components" used in electronics.

We have a stated requirement in a contract for MIL STAN 883B standards, however a supplied C of C states visually & inspected to MIL STAN 750 TM2010 B.

Is this the same/replacement or two different standards?

Thanks for your help

You can go here (http://www.dscc.dla.mil/programs/milspec/ListDocs.asp?BasicDoc=MIL-STD-883) for a copy of MIL-STD-883 and here (http://www.dscc.dla.mil/Programs/MilSpec/listdocs.asp?BasicDoc=MIL-STD-750) for MIL-STD-750. You can download them and compare them for yourself. At a glance they look very similar. Note that the latest revisions for those standards are G and E, respectively, and you're apparently specifying the "B" revision of 883.

Regardless of the comparative applicability of the two documents, the supplier should be following your requirements. You'd think that if they saw a requirement for use of a long-superseded MIL standard, they would have asked for direction.

Help required please.

Could any explain the term "die components" used in electronics.

We have a stated requirement in a contract for MIL STAN 883B standards, however a supplied C of C states visually & inspected to MIL STAN 750 TM2010 B.

Is this the same/replacement or two different standards?

Thanks for your helpThe die in an Integrated Circuit is what the circuit components are etched or built into.

Mil-STD-750 is a test standard for discrete semiconductor devices while MIL-STD-883 is applicable to monolithic ICs (http://en.wikipedia.org/wiki/Integrated_circuit) and Hybrid devices (http://en.wikipedia.org/wiki/Hybrid_circuit).

Hi,
I am not sure what is the product you purchase , dies or a finished IC. A die is the piece of silicon or "chip" that is the "heart" of an IC.
MIL-STD-883 is a compendium of all inspections and tests required of an IC to be compiant to MIL-STD-883 (there aree several quality levels or classes)
One of the inspections required is visual inspection, some of it are according to mil-std-883 and some reference test methods from MIL-STD-750. The COC you refer to seems to be mixed up, as test method 2010 is part of MIL-STD-883, NOT 750. Here is the relevant section of MIL-STD-883:
"3.1 Examination. Internal visual examination as required in 3.1.1 through 3.1.9 shall be conducted on each SAW, hybrid/multichip microcircuit, or microwave hybrid microcircuit. The magnifications required for each inspection shall be those identified in the particular test method used (i.e., 2010, 2017, or 2032 of MIL-STD-883 and 2072, 2073 of MIL-STD-750).
3.1.1 Active and passive elements. All integrated circuit elements shall be examined in accordance with MIL-STD-883,method 2010.
Class H Class K
(Class level B Monolithic) (Class level S Monolithic)
Method 2010; Para. 3.1.1: Metallization defects.
Method 2010; Para. 3.1.2: Diffusion and passivation layer(s) faults.
Method 2010; Para. 3.1.3: Scribing and die defects.
Method 2010; Para. 3.2.5: Foreign material.
Method 2010; Para. 3.1.4: Glassivation defects.
Method 2010; Para 3.1.6: Film resistors defects.
Method 2010; Para. 3.1.7: Laser trimmed film resistor defects.
Transistor and semiconductor diode elements shall be examined in accordance with MIL-STD-883, method 2010 (paragraphs referenced above) or the identified paragraphs of MIL-STD-750, methods 2072 and 2073 as indicated below.
Passive elements (including substrates) shall be examined in accordance with MIL-STD-883, method 2032.Visual MIL-STD-750 MIL-STD-883
Inspection Method 2072 Method 2073 Method 2010...."
Hope this helps
Willy