Hi ppl,

I just started my job on component incoming QA department in my company. I have to revised the work instruction as the previous one is only 2 pages with basically nothing in it. However, for component incoming visual inspection, i could only find the IPC-Std-610D to be a relevant standard in chapter 9 (Component Damage). Is there any other document i should refer to for component incoming inspection?

I have checked Mil-std-883G (External Visual) which only covers hermetically sealed package. IDEA-STD-1010A basically is too raw with no definite criteria to accept or reject and currently still not followed by many manufacturer.

Please advise on it.
Thank you :)

I will like to add on somemore questions regarding IPC standard document.

If we are only going to accept class 3 components, when ipc classified it as class 3 process indicator, we will use the component as it is and cannot reject it right?

For the chip component in this document 610D, in chapter 9, i hav a few questions to ask

1) For the loss of metallization, is it loss of metallization for component by itself before soldering?
2) For the chip resistor and chip component mention here, does it only refer to passive component like resistor and capacitor?Ceramic type material?
3) For section 9.3~the leadled and leadless device, it become quite blur between plastic and ceramic package. Under the target and acceptable section, does it only refer to plastic packages only?
4) Is it correct to assume that unless stated for plastic or ceramic, we can presume the acceptable or defect criteria applicable for both kind of packages?
5) For the defect criteria portion, it seem to talk about ceramic or glass packages only. Will it be applicable for plastic packages too?

Sorry for this much of questions....

anyone can help :(

If we are only going to accept class 3 components, when ipc classified it as class 3 process indicator, we will use the component as it is and cannot reject it right?
If you ask for Class 3 per the IPC standard, and that's what you get, then you got what you asked for, and you might have problems rejecting something. I'm not sure if that's what you were asking, though.

1) For the loss of metallization, is it loss of metallization for component by itself before soldering?
It would apply prior to soldering, I would think, as the manufacturer has no control over your soldering process.

2) For the chip resistor and chip component mention here, does it only refer to passive component like resistor and capacitor?Ceramic type material?
3) For section 9.3~the leadled and leadless device, it become quite blur between plastic and ceramic package. Under the target and acceptable section, does it only refer to plastic packages only?
4) Is it correct to assume that unless stated for plastic or ceramic, we can presume the acceptable or defect criteria applicable for both kind of packages?
5) For the defect criteria portion, it seem to talk about ceramic or glass packages only. Will it be applicable for plastic packages too?
I can't help with any of these without seeing the standard. I've been away from electronics manufacturing for quite a while, and my memory is dim. I think there are others here who might chime in and provide some direction, though.

Sorry for this much of questions....
That's what we're here for. :D

anyone can help :(

Hi guru1000000,

Being weekend, the attendance at the cove is bit sluggish and hence the responses may not be as quick as you would have expected. But be rest assured that you would get responses ;)

If your doubts have not been cleared, pl feel free to add on the queries :cool:

Thanks for the help people. :)...u two have been a great help.

Actually what i mean is whether in IPC, there are 3 classification
1)Acceptable
2)Defect
3)Process indicator
if it is class 3 process indicator , can we accept it or reject it?

Also, actually im using IPC-Std-610D Chapter 9 Component Damage as criterion to reject components during incoming inspection. I could not find any standard around for component visual inspection(before assembly), is there any standard around to dedicate for it? Please advise if there is and let me know if im wrong. Thank you :)

P.S:I have studied the IDEA-Std-1010A but it is very brief for its component rejection criterion. Also, it is still not widely followed in the industry.

Look at the JEDEC standards (http://jedec.org/Catalog/display.cfm) and particularly JESD-B101A. (http://www.jedec.org/download/search/22b101A.pdf) They're available free of charge after registration.

IPC 610-D is a standard for electronic assemblies, such as completed printed circuit boards (PCBs).

What do you mean by "component?" Do you mean a completed PCB with all the IC's, etc. soldered on, or do you mean the IC's, resistors, and other little bits?

If the former, 610-D is the one you want. If the latter, it ain't gonna help.

Its the IC's, resistors, and other little bits. Basically electronic components before soldering. Do you know of any industrial standard to follow for incoming visual inspection?

Reason, im using 610D because it is the standard which i can find that quantify failure criteria. Like how badly is the crack extend that will be reasonable for us to reject it, example: we will reject the component only if the crack expose the internal functional element.

I only used Chapter 9 component damage from this specs and i believe that if
lets say: IPC-610 are going to reject the component if after soldering it has crack and its internal circuitry are exposed. I could use the same rejection criteria to reject component before solderng since before soldering its already achieved the rejection criteria of 610.

Is this reasoning correct? Anyone know what standard is the industrial using for incoming visual inspection? Thanks alot for providing JESD-101A info to me. It is of a great help.

Thank you :)

Its the IC's, resistors, and other little bits. Basically electronic components before soldering. Do you know of any industrial standard to follow for incoming visual inspection?

Reason, im using 610D because it is the standard which i can find that quantify failure criteria. Like how badly is the crack extend that will be reasonable for us to reject it, example: we will reject the component only if the crack expose the internal functional element.

I only used Chapter 9 component damage from this specs and i believe that if
lets say: IPC-610 are going to reject the component if after soldering it has crack and its internal circuitry are exposed. I could use the same rejection criteria to reject component before solderng since before soldering its already achieved the rejection criteria of 610.

Is this reasoning correct? Anyone know what standard is the industrial using for incoming visual inspection? Thanks alot for providing JESD-101A info to me. It is of a great help.

Thank you :)

In most electronics manufacturing companies there isn't a lot of inspection of incoming components beyond simple identification--verifying that the thing received is the thing ordered. Because so much of electronics manufacturing is automated these days, components are often supplied on reels where it's not practical to randomly inspect a received lot. If you're having problems related to the quality of incoming components, you have a problem that inspection isn't going to solve.

What Jim Wynne said in post #10 is correct.

Also the sheer volume of bits is going to make it hard to do any meaningful inspections.

The only exception I can think of is high-dollar SMT/BGA parts that are being bought in the broker's market and are not available in the original packaging. Often these are obsolescent parts encountered for whatever reason.

With SMT parts you can visually inspect the leads for co-planarity. You can look at the solder balls on BGA parts.

If you suspect problems with lead tinning, there are tests for solder adhesion. Unfortunately I can't remember the standard that calls it out. Also there are test labs that can do adhesion/solderability tests for you. I will tell you, though, that these labs were completely puzzled by adhesion problems that surfaced at the start of the no-lead days.

Thanks for the feedback guys :).

But still find it funny that not even sampling of visual inspection of incoming components is done.

If this batch of incomponent packages are cracked, there isnt any inspection to check on it? But instead just verify the quantity that all? I saw both Mil-Std-883 and Jedec has external visual guideline for it.

Thanks for the feedback guys :).

But still find it funny that not even sampling of visual inspection of incoming components is done.

If this batch of incomponent packages are cracked, there isnt any inspection to check on it? But instead just verify the quantity that all? I saw both Mil-Std-883 and Jedec has external visual guideline for it.

The extent of any receiving inspection that's done (or any other inspection, for that matter) should be based on risk and practicality. If you receive a batch of any type of nonconforming material, the likelihood of it happening again and the potential loss as a result of it should figure into what you decide to do about it. The existence of standards for visual inspection doesn't mean that you should consider visual inspection necessary in every case. You need to evaluate the (a) the costs associated with receiving inspection of components and (b) the risks associated with not inspecting them.

Thanks for the feedback guys :).

But still find it funny that not even sampling of visual inspection of incoming components is done.

If this batch of incomponent packages are cracked, there isnt any inspection to check on it? But instead just verify the quantity that all? I saw both Mil-Std-883 and Jedec has external visual guideline for it.The less you handle these components the less likely you will damage them due to ESD. ESD damage may be latent and not discovered until some time after operating in the product.

Several years ago, our company which was a Telephone manufacturing and certified to BABT. What we used as reference is the Quality Control Workmanship Standard from Intertel. I don’t know if this one is available in the amazons.com.
Raffy:cool:

Depends on the component where testing/inspection is possible for damages. 610D gives you some criterias to check for but not practical for certain components due to size.

Ask for certification from suppliers, RI of these components are very hard to do. We do not do any component receiving inspection since some are MSL 3-4 and should not be opened until usage. Verify PN, QTY and type per your purchase order.

Sometime we ask for additonal sample to keep for each lot received incase we have to do investigation.

Guru1000000

I have work for circuit board assembly houses and the receiving inspection is just sampling and external visual verification of marking and values with some testing as applicable. All this needs to be done in a controlled ESD area. I now do detailed inspection on components for telecommunication satellites so there are several procedures to reference.

IC’s reference MIL-PRD-38535, which calls out the MIL-STD-883, for transistors’, and diodes you can reference MIL-PRF-19500, which states use of MIL-STD-750 test methods 2068 & 2071 for external inspection requirements.

If you need some details on the Destructive Physical Analysis you can reference MIL-STD-1580 it shows what companies do and what they look for on the external inspection of various parts.

Hope that helps :D