M
Magus
I have a supplier providing PCB substrates. The PCBs are manufactured in panels. There are 12 functional strips of substrates on the panel. Alignment of the panel is measured in all 4 corners of every panel. No measurement is made on the strip. The only measurement is on the panel.
The recorded measurement is the difference of top layer pattern to bottom layer pattern referenced to a drilled thru hole. The spec is 0 - .004" acceptable.
We are plotting the alignment CpK or CpU (one sided spec) and finding a capability of CpK= 0.86 at best. The supplier tracks this as attribute and I track capability as a variable.
The supplier says all panels pass spec and therefore the process is capable. I feel the process capability is below CpK=1.0 therefore not capable without 100% inspection. I can not afford the value add cost of using poorly aligned substrates.
When can a supplier be allowed shift to sample inspection from 100%
The recorded measurement is the difference of top layer pattern to bottom layer pattern referenced to a drilled thru hole. The spec is 0 - .004" acceptable.
We are plotting the alignment CpK or CpU (one sided spec) and finding a capability of CpK= 0.86 at best. The supplier tracks this as attribute and I track capability as a variable.
The supplier says all panels pass spec and therefore the process is capable. I feel the process capability is below CpK=1.0 therefore not capable without 100% inspection. I can not afford the value add cost of using poorly aligned substrates.
When can a supplier be allowed shift to sample inspection from 100%