P
Priss80
The connector material is SUS303, 1st layer is Ni plating 0.005+/-0.002mm and 2nd layer is tin plating min 0.0076. The end of the connector is solder to PCB pad, does the tin plating at the other end of the connector melt or chip off or abnormality during the soldering due to heat transfer? What is the solution to prevent this?