Exact terms for a plating failure and difference between rejection rate and failure rate

[Anotherstory]

Hello everyone,

Currently, I'm studying passive component (chips) and process terminology and I have a question about plating failures.

There is one defective chip with faulty nickel termination. Nickel was supposed to be plated in the right area but due to a broken coating area in the body,
the nickel was plated in the wrong area which is the body. the ideal shape of the nickel plating area is a neat rectangle but the rejected chip has that kind of nickel stains or blots (smudge?) as shown in the attached image.

Is there a widely accepted term for this failure?

The second question is the difference between rejection rate and failure rate. since English is not my best language and I'm new to this field, I'm not sure which one I should use when I encounter the issue I described above. Could you give me a tip on this word selection?

Any advice will be greatly appreciated.

 

[Anotherstory]

I forgot one more question..

Is an NG used widely in this field? NG as in like defective or failures.(ex: NG products)

Thank you again.

 

[Jim Wynne]

Hello everyone,

Currently, I'm studying passive component (chips) and process terminology and I have a question about plating failures.

There is one defective chip with faulty nickel termination. Nickel was supposed to be plated in the right area but due to a broken coating area in the body,
the nickel was plated in the wrong area which is the body. the ideal shape of the nickel plating area is a neat rectangle but the rejected chip has that kind of nickel stains or blots (smudge?) as shown in the attached image.

Is there a widely accepted term for this failure?

It's not clear whether the area to be plated in your picture is the black or the gray part. What is the plating process (rack, continuous, e.g.)?

The second question is the difference between rejection rate and failure rate. since English is not my best language and I'm new to this field, I'm not sure which one I should use when I encounter the issue I described above. Could you give me a tip on this word selection?

In general , but not always, "failure rate" applies to processes and items that fail in end use, while "rejection rate" will apply to the number of items rejected vs. the number produced.

 

[Jim Wynne]

I forgot one more question..

Is an NG used widely in this field? NG as in like defective or failures.(ex: NG products)

Thank you again.

Assuming that "NG" means "No Good," it's not used widely in the U.S. except in casual conversation, wherein an "F" is often added between the "N" and the "G." I'll leave it to your imagination as to what the "F" stands for.

 

[Anotherstory]

It's not clear whether the area to be plated in your picture is the black or the gray part. What is the plating process (rack, continuous, e.g.)?


In general , but not always, "failure rate" applies to processes and items that fail in end use, while "rejection rate" will apply to the number of items rejected vs. the number produced.

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The grey area is nickel plated area the plating process is to plate the end cap of a chip with nickel and as you can see, that example of a bad chip looks ugly, it should be clean rectangle. and the second one, could you explan further about the failure rate is applied to processes please? I'm still confused. Thank you so much for your answer.

 

[Anotherstory]

Assuming that "NG" means "No Good," it's not used widely in the U.S. except in casual conversation, wherein an "F" is often added between the "N" and the "G." I'll leave it to your imagination as to what the "F" stands for.

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Yes, it's no good. According to your answer, in the manufacturing field, the U.S, it's not used as a defectived or failed? I appreciate your asnwer.

 

[Jim Wynne]

The grey area is nickel plated area the plating process is to plate the end cap of a chip with nickel and as you can see, that example of a bad chip looks ugly, it should be clean rectangle.

I still don't know what method is being used to plate the parts. Are they masked and then rack-plated? Is it continuous (reel-to-reel) plating? I don't know that there's a specific term to describe the problem, but it seems to be some sort of masking failure.

and the second one, could you explan further about the failure rate is applied to processes please? I'm still confused. Thank you so much for your answer.

The two terms (failure rate and rejection rate) could be used interchangeably. In your plating example, what appears to be a masking problem, which means that the process failed. You could keep track of this by monitoring the failure rate of the process. Note that process failure rate might include more than one defective condition.

 

[outdoorsNW]

When you say "passive component (chips)" are you referring to surface mount resistors and capacitors?

 

[Anotherstory]

yes... that is right

 

[Anotherstory]

I still don't know what method is being used to plate the parts. Are they masked and then rack-plated? Is it continuous (reel-to-reel) plating? I don't know that there's a specific term to describe the problem, but it seems to be some sort of masking failure.

The two terms (failure rate and rejection rate) could be used interchangeably. In your plating example, what appears to be a masking problem, which means that the process failed. You could keep track of this by monitoring the failure rate of the process. Note that process failure rate might include more than one defective condition.

---

Thank you so much. I appreciate your answer again. if you don't mind, may I ask you other questions?

1. I'm looking for the right term... it's called 'horizontal delployment' as far as i know, it's from one japanese company, the concept is you have a good improvment idea, it worked out greattly in your plant, so you want to diffuse or apply this idea to another branch of yours since they handle the similiar products. the idea can be about conditions of products, techniques. or practices.. anything. what do you call this practice or activity in the field of manufacturing?

2. there is a certain type of product, you need to make micro adjustment of mixture of raw material. so you mix raw materials first and you proceed with little part of it to certain process to see the mixture ratio is good and to make sure it wont cause any issue when the mixture is used for making some part of your product. the term for this is like pre-production or pre-mass production?

3. I'm still confused between the three terms, defect rate, reject rate, failure rate. if you really don't mind, could you please show me simple examples of these three terms to show differences?