Thanks for your inputs Bobdoering. This is for SPC in-proces monitoring. Actually we will do data collection by performing die shear monitoring lot per lot for 1 week on the worst & best DA machines, then 1x per day afterwards for a month. This data is intended to better understand variations within the set-up, between set-ups, and other potential sources of variations. Do you think this is the way to go?
Currently, we are doing 1X/week in-process monitoring on top of the 2X per day set up buy-off, and we wanted to review if the frequency & sampling size of the current in-process monitoring is adequate.
We wanted to separate set-up buy-off (Set up control) from In-process monitoring (process control).