alonFAI
Involved In Discussions
Hi Guys, I have another question 

I work as a quality engineer in an SMT line.
We have a problem with a relay. When the PCBA undergo ICT test, it indicated that this relay is damaged (functionality). I'm trying to understand what causing it to the relay. One thing I've noticed is, that according to the datasheet of the relay the Tsmin(minimum soak temperature) is 150C while our reflow temperature profile start the soak period with 130C.
Is there any influence for using a lower soak temperature then the minimum component soak temperature dictated by the manufacturer?

I work as a quality engineer in an SMT line.
We have a problem with a relay. When the PCBA undergo ICT test, it indicated that this relay is damaged (functionality). I'm trying to understand what causing it to the relay. One thing I've noticed is, that according to the datasheet of the relay the Tsmin(minimum soak temperature) is 150C while our reflow temperature profile start the soak period with 130C.
Is there any influence for using a lower soak temperature then the minimum component soak temperature dictated by the manufacturer?
Does anyone else have any other idea why this component is failing (at least 40% of our PCBA has this failed component) could it be destroyed by the ICT test itself?
(Again, the fail is functional)
*I've attached a picture with the profile of the component.
Thank you so much!
Alon