Connector Tin Plating Peel-off during Soldering

P

Priss80

#1
The connector material is SUS303, 1st layer is Ni plating 0.005+/-0.002mm and 2nd layer is tin plating min 0.0076. The end of the connector is solder to PCB pad, does the tin plating at the other end of the connector melt or chip off or abnormality during the soldering due to heat transfer? What is the solution to prevent this?
 
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#2
Based on the information you provided:

1) Poor plating quality
2) Too high temperature of the soldering iron
3) Both
4) Another cause

A fish bone / Ishikawa diagram or 5 Why analysis is a good start to look at possible causes and determine root cause.
 
P

Priss80

#7
The J-STD-001 and IPC-A-610 is a guildline for soldering requirement and acceptance level. I think it is more to the technical side on soldering temperature and the conenctor plating thickness and adhesion. The problem now is the user screw and unscrew up to 500 cycles the connector and found plating flakes peel from connector. The user expect no wear-off plating. Does this requirement make sense? How to improve it?
 
P

PaulJSmith

#8
The problem now is the user screw and unscrew up to 500 cycles the connector and found plating flakes peel from connector. The user expect no wear-off plating. Does this requirement make sense? How to improve it?
This was not part of your original question, thus the guidance towards the soldering standards.

You might check with your supplier to find out how they rate that connector, or perhaps if they have a better quality part.
 
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