Defining Post Mold Cure Ramp-Down Temperature

G

gynco

#1
Hi there, is there any standard to follow in defining a Post Mold Cure (PMC) ramp-down temperature for I.C?
1.What are the possible effect on the I.C, if the oven door is immediately open after the curing considering the conditions : RT: 22 to 30 Deg C, RH: 40% to 60%?
Our PMC temperature Oven is set at 170 to 180 degree C.
2. What is the acceptable temperature difference if the parts were subjected to a
oven temp of 170 to 180 deg C. while the RT:: 22 to 30 Deg C, RH: 40% to 60%?
Thank you very much for your kind attention on my inquiry.
:)
 
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M

Murphys Law

#2
I don't recall if there is a standard on this but the risk you want to consider the thermal shock of ramping down from 170C range to room temp.

The concern is one of warpage which could cause package cracking or internal delamination especially as the packages will still be in strip format and want to flex.

One thing to be aware of is the Tg of your mold compound. Above this temperature and is soft malleable. Below it, then it is solid. That is ~125C range depending on the mold compound itself and how Tg measurement technique is defined.

The humidity is not a concern due to the Packages being hotter than ambient and moisture will not ingress.

Ask your mold compound manufacture if they have any recommendations about ramp down times. I know they have one on Post mold cure time. I don't know if your plan is to slightly open the door, fully open the door but you should study it if you want to make this change. Also evaluate difference between fully loaded oven and partially loaded as they will have different thermal loads. You may end up with two temps: One down from 170C to say 150C and after that they can even be removed.
 

Ronen E

Problem Solver
Staff member
Moderator
#3
One thing to be aware of is the Tg of your mold compound. Above this temperature and is soft malleable. Below it, then it is solid. That is ~125C range depending on the mold compound itself and how Tg measurement technique is defined.
Not 100% sure what materials we are talking about, but post-curing usually applies to thermoset, or at least to gelling, ones; while Tg (sounds like you are referring to the glass transition temperature) applies to amorphous thermoplastic resins.

I agree that it's best to consult with the raw material's manufacturer.
 
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