Hi,
I am not sure what is the product you purchase , dies or a finished IC. A die is the piece of silicon or "chip" that is the "heart" of an IC.
MIL-STD-883 is a compendium of all inspections and tests required of an IC to be compiant to MIL-STD-883 (there aree several quality levels or classes)
One of the inspections required is visual inspection, some of it are according to mil-std-883 and some reference test methods from MIL-STD-750. The COC you refer to seems to be mixed up, as test method 2010 is part of MIL-STD-883, NOT 750. Here is the relevant section of MIL-STD-883:
"3.1 Examination. Internal visual examination as required in 3.1.1 through 3.1.9 shall be conducted on each SAW, hybrid/multichip microcircuit, or microwave hybrid microcircuit. The magnifications required for each inspection shall be those identified in the particular test method used (i.e., 2010, 2017, or 2032 of MIL-STD-883 and 2072, 2073 of MIL-STD-750).
3.1.1 Active and passive elements. All integrated circuit elements shall be examined in accordance with MIL-STD-883,method 2010.
Class H Class K
(Class level B Monolithic) (Class level S Monolithic)
Method 2010; Para. 3.1.1: Metallization defects.
Method 2010; Para. 3.1.2: Diffusion and passivation layer(s) faults.
Method 2010; Para. 3.1.3: Scribing and die defects.
Method 2010; Para. 3.2.5: Foreign material.
Method 2010; Para. 3.1.4: Glassivation defects.
Method 2010; Para 3.1.6: Film resistors defects.
Method 2010; Para. 3.1.7: Laser trimmed film resistor defects.
Transistor and semiconductor diode elements shall be examined in accordance with MIL-STD-883, method 2010 (paragraphs referenced above) or the identified paragraphs of MIL-STD-750, methods 2072 and 2073 as indicated below.
Passive elements (including substrates) shall be examined in accordance with MIL-STD-883, method 2032.Visual MIL-STD-750 MIL-STD-883
Inspection Method 2072 Method 2073 Method 2010...."
Hope this helps
Willy