Anotherstory
Registered
Hello everyone,
Currently, I'm studying passive component (chips) and process terminology and I have a question about plating failures.
There is one defective chip with faulty nickel termination. Nickel was supposed to be plated in the right area but due to a broken coating area in the body,
the nickel was plated in the wrong area which is the body. the ideal shape of the nickel plating area is a neat rectangle but the rejected chip has that kind of nickel stains or blots (smudge?) as shown in the attached image.
Is there a widely accepted term for this failure?
The second question is the difference between rejection rate and failure rate. since English is not my best language and I'm new to this field, I'm not sure which one I should use when I encounter the issue I described above. Could you give me a tip on this word selection?
Any advice will be greatly appreciated.
Currently, I'm studying passive component (chips) and process terminology and I have a question about plating failures.
There is one defective chip with faulty nickel termination. Nickel was supposed to be plated in the right area but due to a broken coating area in the body,
the nickel was plated in the wrong area which is the body. the ideal shape of the nickel plating area is a neat rectangle but the rejected chip has that kind of nickel stains or blots (smudge?) as shown in the attached image.
Is there a widely accepted term for this failure?
The second question is the difference between rejection rate and failure rate. since English is not my best language and I'm new to this field, I'm not sure which one I should use when I encounter the issue I described above. Could you give me a tip on this word selection?
Any advice will be greatly appreciated.