Hi everyone
Thanks Google bring me to this cove.
We have a medical laser removal device which powered by PSU. You can control the laser beam emit when the touch pins contacted the skin. The device is intended to use in home healthcare environment.
We defined the touch pins as BF applied part. We found there is no isolated barrier between touch pins and main board and the PSU can only provide 2MOOP between PRI and SEC.
My question is
Cl.8.5.2.1 of 601 3rd standard said F-type applied part shall be separated from other parts.
Is 2MOPP provided between PRI and SEC adequate? Or can we provide impedance protection component (4mm/1.5kv) between touch pins and main board?
Look forward to your early reply. TKS
Thanks Google bring me to this cove.
We have a medical laser removal device which powered by PSU. You can control the laser beam emit when the touch pins contacted the skin. The device is intended to use in home healthcare environment.
We defined the touch pins as BF applied part. We found there is no isolated barrier between touch pins and main board and the PSU can only provide 2MOOP between PRI and SEC.
My question is
Cl.8.5.2.1 of 601 3rd standard said F-type applied part shall be separated from other parts.
Is 2MOPP provided between PRI and SEC adequate? Or can we provide impedance protection component (4mm/1.5kv) between touch pins and main board?
Look forward to your early reply. TKS