GR&R (Gage R&R) for Automated Wafer Probe Testers

D

Deb Lenard

#1
I work in a semiconductor fabrication company and am working with our wafer probe test group to drive improvements in GRR studies. Previous studies were based on creating a 'loadboad' of 10 precision resistors and testing the resistors. Gage R method was used to calculate %GRR. The problem with this approach is that the Gage R method should not be used for final acceptance without more complete MSA methods. Our wafer probe operations are operator independent. 100% of all die are tested to datasheet parameters. I am looking for suggestions from the forum on an acceptable approach that could be used. The problem we are faced with is using actual production wafers for the testing. After probing die on the wafer 3X, bond pad damage is introduced which could ultimately introduce error in measurements. If anyone has any thoughts, I'd sure appreciate your inputs.
 
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B

Bigfoot

#2
Re: GRR for Automated Wafer Probe Testers

Deb,
Is The Gr&r Being Done On A Destructive Test Method? If So A Quick Search Of These Forums Should Yeild Some Valuable Information.
 
D

Deb Lenard

#3
Currently, not destructive. We are using a loadboard connection with the resistors directly connected to the tester. This eliminates the prober interface, probe card, and actual production product being included in the GRR study. As a result, I cannot demonstrate to our customers that our studies include the 'true production process'. Mulitple 'touch downs' on a die (on the wafer) will ultimately result in a destructive test due to damage to the bond pads. In addition, the challenge we face is testing production product across the range of the tester. If we could package the die, this would not be an issue, however, it is not an option at this point in our production process.
 

Miner

Forum Moderator
Staff member
Admin
#4
It was unclear from your posts whether operators had no influence over the operations that made the wafer or the testing of the wafer. Please clarify this.

To avoid damaging the wafers, you could employ destructive MSA techniques on production wafers. This test is not as powerful as the standard MSA, but will provide the information that you need.

If operators do impact the test (even by wafer placement in the tester) and if you can get away with 4 tests on a wafer without damage, use two operators and two repeats per wafer.

If the operators do not impact the test (i.e., it is fully automated, including placement of the sample), test more parts at a safe number of repeats per part. This will assume Reproducibility is zero and provide a measure of Repeatability compared to part variation.
 
D

Deb Lenard

#5
Thanks for the inputs. The process is totally independent of operators (fully automated system). Testing more parts at a safe number of repeats per part is an option. We had not though about using destructive techniques, but will consider.
 

Bev D

Heretical Statistician
Staff member
Super Moderator
#6
I don't think you need to probe more than twice. I know the "traditional" GRR method uses 3 repeated measures but really 2 is sufficient. (you don't get that much better estimate of the measuremetn error standard deviation with 3readings than with 2; you will get better accuracy by using 30 different die read twice than 10 die read 3 times...)

If you are worried about bond pad damamge tehn program the tester to mark the die you use for the study as rejected so you don't assemble them.

In order to select the most representative die to test you should first understand how the product variation is distributed: if all of the variation is represented within a wafer then you only need to test one wafer. However, if you have significant lot to lot varation you may need to sample across lots. Worst case is several die on a wafer, several wafers per lot and several lots to get 30 sampled die.

I woudl aslo strongly recommend that you research Donald Wheeler - you can find several references and threads in this forum. His work (there are others but his is the most commonly available) details a method that I use instead of the traditional method....
 
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