Thanks for all the answers.
First let me give more details about the process.
Actually it¡¯s refering to inspection after wire bonding process, and the upper mentioned defect is "no wire"(which is "missing bonding", ppm level is no more than 10ppm based on former 100% visual inspection). Management don't want to see such failure as if such failure could be detected then it could be reworked to reduce chip loss.
Due to manpower restriction, sampling is requested to replce 100% VI.
From above answers, I understand that if follow AQL=0.01 it's not able to detect such failure, thanks you all.
So there's no need to perform sampling inspection for a single defect of "no wire". But I want understand more on this question.
Now let's consider all the detects of wirebonding. The target is 140ppm, and now the actual average ppm level is about 80ppm(based on a self inspection conducted by wire bonding operator, sample size is about 8.3% of lot size(n/N=8.3%, lot size is about 10k-25k).
The question is:
1. If accept a ppm of 80ppm, AQL=? Sample size=? How to calculate?
2. Is the sample size of about 8.3% lot size enough to detect the defects of about 80ppm?