Z
Hello all,
Do you have any test experience regarding to the section 13.2.7 Impairment of cooling?
We have a straight airflow through a device, and we don't want to use thermal cutoff for overheating. (We want to eliminate the possibility of overheating by redundant ventilation) So we think about a rack mountable design, which has a ventilator on both sides:
_______
| <--- |
|_____|
<-- airflow
The question is, what does "the flow of the cooling agent interrupted" actually means when testing? do they cover all the ventilation holes?
Pushing the device "next to a wall" is ok for us, because the rack mounting edge is lolled out.
We would like to test a device for the 2nd edition, but I have only the 3rd.
Are there any difference?
Please give me your opinion, whether if using a thermal cutoff is obligatory in this case or not..
I'm a 60601 newbie .. thank you in advance!
Gergő
Do you have any test experience regarding to the section 13.2.7 Impairment of cooling?
We have a straight airflow through a device, and we don't want to use thermal cutoff for overheating. (We want to eliminate the possibility of overheating by redundant ventilation) So we think about a rack mountable design, which has a ventilator on both sides:
_______
| <--- |
|_____|
<-- airflow
The question is, what does "the flow of the cooling agent interrupted" actually means when testing? do they cover all the ventilation holes?
Pushing the device "next to a wall" is ok for us, because the rack mounting edge is lolled out.
We would like to test a device for the 2nd edition, but I have only the 3rd.
Are there any difference?
Please give me your opinion, whether if using a thermal cutoff is obligatory in this case or not..
I'm a 60601 newbie .. thank you in advance!
Gergő
