IPC-610 Section 10.4.2.2 clarification - Distance to be measured

#1
Hopefully I have placed this in the correct area to find help...

An internal issue came to me recently regarding IPC A 610 (Acceptability of Electronic Assemblies)

I have reached out to IPC and our customer but am still seeking resolution.

Specifically looking at Section 10.4.2.2 Flexible and Rigid-Flex Printed Circuitry -Delamination/Blister - Flex to Stiffener

It states:
Acceptable - Class 2,3
• The distance from stiffener board edge in the section of flex
circuit which is intended to remain straight is 0.5 mm
[0.02 in] or less.
• The distance from stiffener board edge in the section of the
flex circuit which is intended to bend is 0.3 mm [0.01 in] or
less.

I am not understanding the distance that is to be measured. Any help?

Thanks
 
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