IPC-A-610- section 5.2.7.2 Bridging

#1
We have a PCB that was assembled with poor workmanship (being addressed) leaving bridging in various locations is the question. We are under Class II call out. My concern is the bridging is on some components that are on the same trace to a common ground. I understand bridging is a defect but, to avoid damaging the board and components can bridging be left if it's to common ground pads or component ground planes. the paragraph in the book doesn't address this. OR can I say bridging no matter what is a defect?
 
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#2
The standard clearly defines bridging as a defect. How you disposition it is another matter. Is this board a product being used in-house, or is it being made for a customer? You say " We are under Class II call out." Where is class II specified?
 
#4
The assembly is for military use. The assembly drawing calls out IPC-A-610 Class II. What do you mean by "how you disposition it"?
To disposition a rejected or questioned item is to decide what to do with it--scrap, repair, use-as-is, etc.. Given the information available here, I can't imagine use-as-is being a reasonable disposition.
 
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