J
Hello all,
My questions are about IPC/EIA J-STD-004 - Requirements for Soldering Fluxes.
Could you please assist me to find answer of the questions listed below.?
1. Why the use of H type flux in the solder paste is not prefered for Class III equipment production?
2. Any negative impact recorded at IPC since the use of solder paste with H type flux and so that corrective action taken?
3. What kind of solder paste is acceptable for DoD requirements and other Class III equipment production?
4. What type of water soluable solder paste prefferable for Class III applications?
4. Do IPC suggest any specific method to measure the thickness of the solder paste on the PWB before beginning the process?
Regards,
My questions are about IPC/EIA J-STD-004 - Requirements for Soldering Fluxes.
Could you please assist me to find answer of the questions listed below.?
1. Why the use of H type flux in the solder paste is not prefered for Class III equipment production?
2. Any negative impact recorded at IPC since the use of solder paste with H type flux and so that corrective action taken?
3. What kind of solder paste is acceptable for DoD requirements and other Class III equipment production?
4. What type of water soluable solder paste prefferable for Class III applications?
4. Do IPC suggest any specific method to measure the thickness of the solder paste on the PWB before beginning the process?
Regards,