IPC/EIA J-STD-004 - Requirements for Soldering Fluxes

J

johnjbart

#1
Hello all,

My questions are about IPC/EIA J-STD-004 - Requirements for Soldering Fluxes.

Could you please assist me to find answer of the questions listed below.?

1. Why the use of H type flux in the solder paste is not prefered for Class III equipment production?

2. Any negative impact recorded at IPC since the use of solder paste with H type flux and so that corrective action taken?

3. What kind of solder paste is acceptable for DoD requirements and other Class III equipment production?

4. What type of water soluable solder paste prefferable for Class III applications?

4. Do IPC suggest any specific method to measure the thickness of the solder paste on the PWB before beginning the process?

Regards,
 
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J

johnjbart

#3
Although I have that article, it's not included really answer of my questions.
Could you please explain some, if you have.

Regards,
 
E

e006823

#4
1. Why the use of H type flux in the solder paste is not preferred for Class III equipment production?

Type H flux is extremely active, the greater the activity level of a flux the more hazardous the flux and it’s residues are to the reliability of the connection (i.e. potential corrosion and joint failure). For the same reason the DoD used to require that only type R or RMA flux be used on assemblies. There are approximate J-Std-004 equivalents and Kester or Cookson can help you with this.

2. Any negative impact recorded at IPC since the use of solder paste with H type flux and so that corrective action taken?

I have no idea.

3. What kind of solder paste is acceptable for DoD requirements and other Class III equipment production?

I don’t believe the DoD has gone lead free yet. We used to use 63/37. What does your SOW or contract say?

4. What type of water soluble solder paste preferable for Class III applications?

I don’t believe you can water soluble paste without subsequent testing and customer approval unless they are “activity levels L0 or L1 of flux materials rosin (R0), resin (RE) or organic (OR), except organic flux activity level L1 shall not be used for no-clean soldering”. Typical testing includes but may not be limited to depending on your customer) surface insulation resistance (SIR) and visual inspection for corrosion, dendrite formation and measeling of conformal.

5. Do IPC suggest any specific method to measure the thickness of the solder paste on the PWB before beginning the process?

Not that I’m aware of, the J-Std- just requires you to meet the workmanship requirements for the class of work you are performing. Solder thickness is a function of aperture size, stencil thickness and paste viscosity (amongst other things) . Excessive paste may result in excessive solder on the joints and possibly shorts while to little paste will result in insufficient both rejectable in the J-Std. You ned to determine the the paste thickness required for your process in the development stages. See the following links for more information:

http://www.alphametals.com/products/stencils/design_guide.html
http://www.tutorialsweb.com/smt/chapter5.htm
 
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