IPC-Std-610D Component Incoming (Receiving) Visual Inspection

G

guru1000000

#1
Hi ppl,

I just started my job on component incoming QA department in my company. I have to revised the work instruction as the previous one is only 2 pages with basically nothing in it. However, for component incoming visual inspection, i could only find the IPC-Std-610D to be a relevant standard in chapter 9 (Component Damage). Is there any other document i should refer to for component incoming inspection?

I have checked Mil-std-883G (External Visual) which only covers hermetically sealed package. IDEA-STD-1010A basically is too raw with no definite criteria to accept or reject and currently still not followed by many manufacturer.

Please advise on it.
Thank you :)
 
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G

guru1000000

#2
Re: IPC-Std-610D Incoming Visual Inspection

I will like to add on somemore questions regarding IPC standard document.

If we are only going to accept class 3 components, when ipc classified it as class 3 process indicator, we will use the component as it is and cannot reject it right?

For the chip component in this document 610D, in chapter 9, i hav a few questions to ask

1) For the loss of metallization, is it loss of metallization for component by itself before soldering?
2) For the chip resistor and chip component mention here, does it only refer to passive component like resistor and capacitor?Ceramic type material?
3) For section 9.3~the leadled and leadless device, it become quite blur between plastic and ceramic package. Under the target and acceptable section, does it only refer to plastic packages only?
4) Is it correct to assume that unless stated for plastic or ceramic, we can presume the acceptable or defect criteria applicable for both kind of packages?
5) For the defect criteria portion, it seem to talk about ceramic or glass packages only. Will it be applicable for plastic packages too?

Sorry for this much of questions....
 

Jim Wynne

Staff member
Admin
#4
Re: IPC-Std-610D Incoming Visual Inspection

If we are only going to accept class 3 components, when ipc classified it as class 3 process indicator, we will use the component as it is and cannot reject it right?
If you ask for Class 3 per the IPC standard, and that's what you get, then you got what you asked for, and you might have problems rejecting something. I'm not sure if that's what you were asking, though.

1) For the loss of metallization, is it loss of metallization for component by itself before soldering?
It would apply prior to soldering, I would think, as the manufacturer has no control over your soldering process.

2) For the chip resistor and chip component mention here, does it only refer to passive component like resistor and capacitor?Ceramic type material?
3) For section 9.3~the leadled and leadless device, it become quite blur between plastic and ceramic package. Under the target and acceptable section, does it only refer to plastic packages only?
4) Is it correct to assume that unless stated for plastic or ceramic, we can presume the acceptable or defect criteria applicable for both kind of packages?
5) For the defect criteria portion, it seem to talk about ceramic or glass packages only. Will it be applicable for plastic packages too?
I can't help with any of these without seeing the standard. I've been away from electronics manufacturing for quite a while, and my memory is dim. I think there are others here who might chime in and provide some direction, though.

Sorry for this much of questions....
That's what we're here for. :D
 

Ajit Basrur

Staff member
Admin
#5
Hi guru1000000,

Being weekend, the attendance at the cove is bit sluggish and hence the responses may not be as quick as you would have expected. But be rest assured that you would get responses ;)

If your doubts have not been cleared, pl feel free to add on the queries :cool:
 
G

guru1000000

#6
Thanks for the help people. :)...u two have been a great help.

Actually what i mean is whether in IPC, there are 3 classification
1)Acceptable
2)Defect
3)Process indicator
if it is class 3 process indicator , can we accept it or reject it?

Also, actually im using IPC-Std-610D Chapter 9 Component Damage as criterion to reject components during incoming inspection. I could not find any standard around for component visual inspection(before assembly), is there any standard around to dedicate for it? Please advise if there is and let me know if im wrong. Thank you :)

P.S:I have studied the IDEA-Std-1010A but it is very brief for its component rejection criterion. Also, it is still not widely followed in the industry.
 
C

CliffK

#8
IPC 610-D is a standard for electronic assemblies, such as completed printed circuit boards (PCBs).

What do you mean by "component?" Do you mean a completed PCB with all the IC's, etc. soldered on, or do you mean the IC's, resistors, and other little bits?

If the former, 610-D is the one you want. If the latter, it ain't gonna help.
 
G

guru1000000

#9
Its the IC's, resistors, and other little bits. Basically electronic components before soldering. Do you know of any industrial standard to follow for incoming visual inspection?

Reason, im using 610D because it is the standard which i can find that quantify failure criteria. Like how badly is the crack extend that will be reasonable for us to reject it, example: we will reject the component only if the crack expose the internal functional element.

I only used Chapter 9 component damage from this specs and i believe that if
lets say: IPC-610 are going to reject the component if after soldering it has crack and its internal circuitry are exposed. I could use the same rejection criteria to reject component before solderng since before soldering its already achieved the rejection criteria of 610.

Is this reasoning correct? Anyone know what standard is the industrial using for incoming visual inspection? Thanks alot for providing JESD-101A info to me. It is of a great help.

Thank you :)
 

Jim Wynne

Staff member
Admin
#10
Its the IC's, resistors, and other little bits. Basically electronic components before soldering. Do you know of any industrial standard to follow for incoming visual inspection?

Reason, im using 610D because it is the standard which i can find that quantify failure criteria. Like how badly is the crack extend that will be reasonable for us to reject it, example: we will reject the component only if the crack expose the internal functional element.

I only used Chapter 9 component damage from this specs and i believe that if
lets say: IPC-610 are going to reject the component if after soldering it has crack and its internal circuitry are exposed. I could use the same rejection criteria to reject component before solderng since before soldering its already achieved the rejection criteria of 610.

Is this reasoning correct? Anyone know what standard is the industrial using for incoming visual inspection? Thanks alot for providing JESD-101A info to me. It is of a great help.

Thank you :)
In most electronics manufacturing companies there isn't a lot of inspection of incoming components beyond simple identification--verifying that the thing received is the thing ordered. Because so much of electronics manufacturing is automated these days, components are often supplied on reels where it's not practical to randomly inspect a received lot. If you're having problems related to the quality of incoming components, you have a problem that inspection isn't going to solve.
 
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