IPC-Std-610D Component Incoming (Receiving) Visual Inspection

C

CliffK

#11
What Jim Wynne said in post #10 is correct.

Also the sheer volume of bits is going to make it hard to do any meaningful inspections.

The only exception I can think of is high-dollar SMT/BGA parts that are being bought in the broker's market and are not available in the original packaging. Often these are obsolescent parts encountered for whatever reason.

With SMT parts you can visually inspect the leads for co-planarity. You can look at the solder balls on BGA parts.

If you suspect problems with lead tinning, there are tests for solder adhesion. Unfortunately I can't remember the standard that calls it out. Also there are test labs that can do adhesion/solderability tests for you. I will tell you, though, that these labs were completely puzzled by adhesion problems that surfaced at the start of the no-lead days.
 
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G

guru1000000

#12
Thanks for the feedback guys :).

But still find it funny that not even sampling of visual inspection of incoming components is done.

If this batch of incomponent packages are cracked, there isnt any inspection to check on it? But instead just verify the quantity that all? I saw both Mil-Std-883 and Jedec has external visual guideline for it.
 

Jim Wynne

Staff member
Admin
#13
Thanks for the feedback guys :).

But still find it funny that not even sampling of visual inspection of incoming components is done.

If this batch of incomponent packages are cracked, there isnt any inspection to check on it? But instead just verify the quantity that all? I saw both Mil-Std-883 and Jedec has external visual guideline for it.
The extent of any receiving inspection that's done (or any other inspection, for that matter) should be based on risk and practicality. If you receive a batch of any type of nonconforming material, the likelihood of it happening again and the potential loss as a result of it should figure into what you decide to do about it. The existence of standards for visual inspection doesn't mean that you should consider visual inspection necessary in every case. You need to evaluate the (a) the costs associated with receiving inspection of components and (b) the risks associated with not inspecting them.
 

Al Rosen

Staff member
Super Moderator
#14
Thanks for the feedback guys :).

But still find it funny that not even sampling of visual inspection of incoming components is done.

If this batch of incomponent packages are cracked, there isnt any inspection to check on it? But instead just verify the quantity that all? I saw both Mil-Std-883 and Jedec has external visual guideline for it.
The less you handle these components the less likely you will damage them due to ESD. ESD damage may be latent and not discovered until some time after operating in the product.
 

Raffy

Quite Involved in Discussions
#15
Several years ago, our company which was a Telephone manufacturing and certified to BABT. What we used as reference is the Quality Control Workmanship Standard from Intertel. I don’t know if this one is available in the amazons.com.
Raffy:cool:
 
Q

quality1

#16
Depends on the component where testing/inspection is possible for damages. 610D gives you some criterias to check for but not practical for certain components due to size.

Ask for certification from suppliers, RI of these components are very hard to do. We do not do any component receiving inspection since some are MSL 3-4 and should not be opened until usage. Verify PN, QTY and type per your purchase order.

Sometime we ask for additonal sample to keep for each lot received incase we have to do investigation.
 
S

sfkevin

#17
Guru1000000

I have work for circuit board assembly houses and the receiving inspection is just sampling and external visual verification of marking and values with some testing as applicable. All this needs to be done in a controlled ESD area. I now do detailed inspection on components for telecommunication satellites so there are several procedures to reference.

IC’s reference MIL-PRD-38535, which calls out the MIL-STD-883, for transistors’, and diodes you can reference MIL-PRF-19500, which states use of MIL-STD-750 test methods 2068 & 2071 for external inspection requirements.

If you need some details on the Destructive Physical Analysis you can reference MIL-STD-1580 it shows what companies do and what they look for on the external inspection of various parts.

Hope that helps :D
 
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