C
What Jim Wynne said in post #10 is correct.
Also the sheer volume of bits is going to make it hard to do any meaningful inspections.
The only exception I can think of is high-dollar SMT/BGA parts that are being bought in the broker's market and are not available in the original packaging. Often these are obsolescent parts encountered for whatever reason.
With SMT parts you can visually inspect the leads for co-planarity. You can look at the solder balls on BGA parts.
If you suspect problems with lead tinning, there are tests for solder adhesion. Unfortunately I can't remember the standard that calls it out. Also there are test labs that can do adhesion/solderability tests for you. I will tell you, though, that these labs were completely puzzled by adhesion problems that surfaced at the start of the no-lead days.
Also the sheer volume of bits is going to make it hard to do any meaningful inspections.
The only exception I can think of is high-dollar SMT/BGA parts that are being bought in the broker's market and are not available in the original packaging. Often these are obsolescent parts encountered for whatever reason.
With SMT parts you can visually inspect the leads for co-planarity. You can look at the solder balls on BGA parts.
If you suspect problems with lead tinning, there are tests for solder adhesion. Unfortunately I can't remember the standard that calls it out. Also there are test labs that can do adhesion/solderability tests for you. I will tell you, though, that these labs were completely puzzled by adhesion problems that surfaced at the start of the no-lead days.