Schwarzyzi
Registered
Hello Everyone,
We are designing electronics for a ME equipment, the device is class I, the applied parts are BF.
Our power supply is medical grade and provide a low DC voltage (<50Vdc) to power the secondary circuits and our secondary circuits are reliably connected to ground (which is PE) to provide 0V.
We have designed our isolation diagram with 1 MOOP between secondary circuits and the enclosure of the device, that is reliably connected to PE, as stated in annex J.1 of 60601-1 :
We are having a hard time figuring how to isolate a grounded secondary circuits from PE since PE is part of the circuit. We thought that each conductive part of the circuit board should be under the creepage and clearance of the isolation diagram from PE but we have boards with digital electronics that have small integrated components, it is impossible to maintain the requirements of 1MOOP on such circuits.
Do you see anything that we missed ? Is it normal to try to isolate a grounded secondary circuit from ground ?
We are designing electronics for a ME equipment, the device is class I, the applied parts are BF.
Our power supply is medical grade and provide a low DC voltage (<50Vdc) to power the secondary circuits and our secondary circuits are reliably connected to ground (which is PE) to provide 0V.
We have designed our isolation diagram with 1 MOOP between secondary circuits and the enclosure of the device, that is reliably connected to PE, as stated in annex J.1 of 60601-1 :
We are having a hard time figuring how to isolate a grounded secondary circuits from PE since PE is part of the circuit. We thought that each conductive part of the circuit board should be under the creepage and clearance of the isolation diagram from PE but we have boards with digital electronics that have small integrated components, it is impossible to maintain the requirements of 1MOOP on such circuits.
Do you see anything that we missed ? Is it normal to try to isolate a grounded secondary circuit from ground ?