Q
qualitygoddess - 2010
I'm in need of some assistance with this JEDEC standard. Anyone out there? Here are the specific questions:
1. If a product is MSL1, no MSID label is required. However, I have some suppliers who use these labels when they send me blank IC's. Is this a good idea to use labels for MSL1, even though not required by J-STD-033?
2. For MSL3 product stored in a dry cabinet, if we maintain the humidity in the cabinet at <10%, is there an upper limit on the storage temperature? I'm looking at page 6 of the std, on the Caution label. See 3b.
I ask #2 because we will be receiving RoHS compliant product from a supplier and the MSL has changed from 1 to 3. I guess with the higher reflow temps for lead free solder, the IC's don't pass MSL1 at 260 degress C.
3. how does this MET (manufacturer exposure time) work? If we pull out chips for 8 hours of programming time, then package into a moisture barrier bag (MBB) with proper dessicant, does the MET "clock" reset? Or do we have to tell the customer that they have lost 8 hours of MET? FYI: we buy blank IC chips, program with a custom program and then sell.
4. very last question -- how should a supplier prove that their products are compliant with RoHS? I think I need them to provide the TCLP test results. Your thoughts?
If anyone has a suggestion of a better forum on which to post these questions, let me know. And many thanks in advance for your help!
--QG
1. If a product is MSL1, no MSID label is required. However, I have some suppliers who use these labels when they send me blank IC's. Is this a good idea to use labels for MSL1, even though not required by J-STD-033?
2. For MSL3 product stored in a dry cabinet, if we maintain the humidity in the cabinet at <10%, is there an upper limit on the storage temperature? I'm looking at page 6 of the std, on the Caution label. See 3b.
I ask #2 because we will be receiving RoHS compliant product from a supplier and the MSL has changed from 1 to 3. I guess with the higher reflow temps for lead free solder, the IC's don't pass MSL1 at 260 degress C.
3. how does this MET (manufacturer exposure time) work? If we pull out chips for 8 hours of programming time, then package into a moisture barrier bag (MBB) with proper dessicant, does the MET "clock" reset? Or do we have to tell the customer that they have lost 8 hours of MET? FYI: we buy blank IC chips, program with a custom program and then sell.
4. very last question -- how should a supplier prove that their products are compliant with RoHS? I think I need them to provide the TCLP test results. Your thoughts?
If anyone has a suggestion of a better forum on which to post these questions, let me know. And many thanks in advance for your help!
--QG