foreign objects
Al, I believe your post more accurately describes what Lockheed Martin is after. I can recall performing FOD on battery packs for Captor mines. If a small strip of wire, or solder spatter, or anything else that was conductive entered the battery pack compartment prior to sealing, the results could be catastrophic!
On another note consider a small solder ball lodged inside the hermetic seal of a canned relay. In the past our labs would conduct particle impact testing on such devices to root out any foreign particles that might create a short circuit causing catastrophic failure.
All electronic assemblers and solders received training in this regard at Goodyear Aerospace in the 1980's, which just happens to be Lockheed Martin today.