Hello,
I have a design where I had to connect the PCB Ground to the metal enclosure to pass ESD testing. The device gets its power from an external DC power supply (12V), therefore it is considered a secondary circuit. The device is NOT an applied part. However, I am concerned with Touch Current. The operator may come in contact with the enclosure of the device, and the patient at the same time. According to the IEC 60601-1 (Ed. 3.2) in Section 8.4.2 (b), these limits for Touch Current shall not be exceeded: 100 μA in NORMAL CONDITION and 500 μA in SINGLE FAULT CONDITION.
My questions are as follows:
* How do I address the concern that the Touch Current through the metal enclosure may exceed above limits since the PCB ground is connected to the enclosure?
* Do I really need to worry about implementing air clearance and creepage distance requirements for MOOP even though the voltage is relatively low (12V) and I have a 3A fuse?
Any help would be really appreciated.
Thank you
I have a design where I had to connect the PCB Ground to the metal enclosure to pass ESD testing. The device gets its power from an external DC power supply (12V), therefore it is considered a secondary circuit. The device is NOT an applied part. However, I am concerned with Touch Current. The operator may come in contact with the enclosure of the device, and the patient at the same time. According to the IEC 60601-1 (Ed. 3.2) in Section 8.4.2 (b), these limits for Touch Current shall not be exceeded: 100 μA in NORMAL CONDITION and 500 μA in SINGLE FAULT CONDITION.
My questions are as follows:
* How do I address the concern that the Touch Current through the metal enclosure may exceed above limits since the PCB ground is connected to the enclosure?
* Do I really need to worry about implementing air clearance and creepage distance requirements for MOOP even though the voltage is relatively low (12V) and I have a 3A fuse?
Any help would be really appreciated.
Thank you