Metal parts bonding/grounding on Class II, internally powered with functional earth?

#1
Hi all,

Thank you for reading my post and contributing.

I'm working on a Class II device that is internally powered (medical bed). The medical bed can be operated by itself, as well as when it is docked to a parent device.

The bed's internal structure is made of metal parts which will be ultimately bonded and grounded when docked (as much as it permits - this is our design preference).

I'm not aware of any 60601 clause or requirement that forces us to bond & ground the internal metal parts on a Class II device (other than 6.2 clause, the medical bed does NOT have any means of mains connection - it does but it is not user accessible in any form).

I would like to ensure that we're not forced to bond and ground the internal metal parts in case this might change in the future.
However, I wonder if this arrangement will have to be classified as a "functional earth" connection which then will prevent any potential changes in the future.

Thanks again,
Mark
 
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