I cannot recall anything specifically on PCB's, but IEC 62309 gives a framework and terminology that can be used in consideration.
A critical part would be risk management, you should probably look at the inputs of your
FMEA, as your current one most likely is based on a 'virgin' device. It would also change your occurrence/reliability percentages (if used) in any FTA you have lying around.
Another major part would be your process to release the part for production, as it most likely cannot meet specifications with all the commensurate paperwork like a fresh part would. What are you checking on, what are you dropping, where do you accept a lower grade of performance or a wider tolerance on your pass requirement (and perhaps more importantly: where can you not do so due to risk management).