Which type of study would be better for Solder Paste Height Measurement system

sowmya

Involved - Posts
#1
Hello Experts,

We are contract manufacturers in EMS industry and we have a process called solder paste printing on the Printed circuit board.The process is we have a stencil (of defined thickness -4 to 6 mils) and paste is applied over it by automatic paste dispensing system. The height of paste is also measured by the Height measurement machine. We want to conduct MSA for it.

Which type of study would be better. Could anybody please advise?

The viscosity of the paste will change as time passes. so we need to do the study in short duration. Max. 1 hour.

Thanks in advance:thanx:

Sowmya
 
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harrysons

Realistic Quality
#2
Hello Experts,

We are contract manufacturers in EMS industry and we have a process called solder paste printing on the Printed circuit board.The process is we have a stencil (of defined thickness -4 to 6 mils) and paste is applied over it by automatic paste dispensing system. The height of paste is also measured by the Height measurement machine. We want to conduct MSA for it.

Which type of study would be better. Could anybody please advise?

The viscosity of the paste will change as time passes. so we need to do the study in short duration. Max. 1 hour.

Thanks in advance:thanx:

Sowmya
Hi Sowmya

I think you look better the SPC system... so you can find the Cpk on it..
hope it can help. or may others expert can share better study you are looking for.

Rgds,
Harry
 

sowmya

Involved - Posts
#4
It is not AOI harry. A laser beam is passed across the board and wherever the paste is there, the beam shifts littlebit and the shift is measured by the machine.

The machine is caltex SPM-300

http :// www. caltexsci.com/solder_paste_measurement.htm - OBSOLETE BROKEN 404 LINK(s) UNLINKED - PLEASE HELP - REPORT POSTS WITH BROKEN LINKS

Thanks

Sowmya
 
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bobdoering

Stop X-bar/R Madness!!
Trusted Information Resource
#5
I would collect 10 boards, measure the solder height on the same location for all 10 three times. If the paste is degrading over time, have one operator measure, then the next, then the final, then go back to the first operator for the second trial. If there is any operator intervention (which I doubt, but wouldn't hurt to prove) have two other operators perform the measurement. Pretty much a standard gage R&R. Now, that is only one facet of a full MSA. You still need to look at calibration, including linearity and stability. I am guessing your question was primarily Gage R&R, though.
 
E

e006823

#6
A lot of variables can effect the solder volume, paste viscosity, stencil thickness, aperture size, snap off height, squeegee wear, pressure,hardness, print speed and flatness of the PWBs to name a few.

I would treat this the same as I would a MSA on a destructive measurement (e.g. pull strength).

There's a good article here:
Industrial and Systems Engineering | P.C. Rossin College of Engineering & Applied Science

and the Non-Replicable Study article here:

Aiag Gage R R PDF | Download Free Ebook Aiag Gage R R


and this might be helpful:
http :// www. cyberoptics.com/client_files/documents/SE300_Gr_r_TV.pdf - OBSOLETE BROKEN 404 LINK(s) UNLINKED - PLEASE HELP - REPORT POSTS WITH BROKEN LINKS
 
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bobdoering

Stop X-bar/R Madness!!
Trusted Information Resource
#7
A lot of variables can effect the solder volume, paste viscosity, stencil thickness, aperture size, snap off height, squeegee wear, pressure,hardness, print speed and flatness of the PWBs to name a few.
I agree, and the gage R&R specimens should be representative of as many of those conditions to ensure the gage can detect the variation. That may require more than 10 samples - and if so, that is OK.


I would treat this the same as I would a MSA on a destructive measurement (e.g. pull strength).
I disagree, the measurement itself is not destructive. Each specimen can be measured more than once.

There's a good article here:
http ://www. lehigh.edu/ise/documents/99t_007.pdf - OBSOLETE BROKEN 404 LINK(s) UNLINKED - PLEASE HELP - REPORT POSTS WITH BROKEN LINKS
This is a good article. They do not treat it as destructive. They do over think the issue, as one would expect them to do in an academic article. They measure everything about the volume of the solder paste. Does the OP need to know all of these factors - or just the height?
 
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Bev D

Heretical Statistician
Staff member
Super Moderator
#8
Bob has it exactly. this isn't a destruct test; it's a straightforward R&R study.


I would recommend an alternative sample structure: 30 boards, measured twice each by 2-3 operators. It's the same number of measurements, but there is more statistical - and informative - horsepower in measuring more parts twice than in measuring fewer parts 3 times...
 
E

e006823

#9
I disagree, the measurement itself is not destructive. Each specimen can be measured more than once.
Agreed.

My comment was based on past experience supporting a PWB assembly line. Operations didn't want any boards "laying around" or non production related experiments tying up production assets. As a work around we decided to treat this as a destructive MSA. Samples measured once and then continue through the manufacturing process. It was an effective compromise.

This may have no bearing on the OPs operating environment or production needs
 

bobdoering

Stop X-bar/R Madness!!
Trusted Information Resource
#10
Bob has it exactly. this isn't a destruct test; it's a straightforward R&R study.


I would recommend an alternative sample structure: 30 boards, measured twice each by 2-3 operators. It's the same number of measurements, but there is more statistical - and informative - horsepower in measuring more parts twice than in measuring fewer parts 3 times...
I agree, that would be better than just 10 boards (just didn't want to be greedy).

But be sure it is the same pad location on each of the boards. As the article states, there can be a lot of variation and I suggest you just want to capture the variation limited to one location and it's particular effects. The rest of the variation issues across the board are the realm of the process capability study, not a gage study. Need to keep them separate.
 
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