e006823:
1) Moisture sensitivity issues.
2) Solderability issues.
3) Damage due to ESD/EOS events.
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This is a good place to start.
Assess the components on this basis.
1) As the compoents usuceptible to moisture absorption? have they been stored in sealed bags? Did the bags include dessicant? Did the bags have moisture indicator cards added... if so, what do they say?
Consider a long, low temeprature bake to drive moisture out of devices if they are considered 'risky' but you really ahve to use them (hi value, or hard to obtain) - but bear in mind that baking can have a detrimental effect on the solderability, which leads on to...
2) Take a statistical sample of the devices, and run solderability trails on them
Look at the surface finish.... is it dark, powdery, oxidized, rainbow colored?
Use the results of your solderability tests to make a determination of the accprtability of the parts, and then longer term, improve this process by looking at the soldering defects you suffer in production with regard to these components.
3) Damage due to ESD is incredibly difficult to identify, but if components have been kicking around for years, completely unprotected, then you are setting yourself up for a nightmare of in-test failures, repeated diagnostic loops, dead-on-arrivals, early life failures and warranty returns, if the device is stated to be ESD sensitive, and it's not been protected, consider finding a dustbin.
If however, the devices have been stored in non-esd generating materials, and/or sealed in dissapative bags, then they stand a good chance of being ok (bearing in mind points 1 and 2 above).
Good luck with this, and consider a lessons learned with regard to your storage of parts in future.
Edit: Don't forget that these devices may not be RoHS compliant - consider the impacts of this on your products
