I was wondering whether you have any experience with moving a Printed Circuit Board Assembly (PCA) from a lead based soldering standard to a lead free soldering standard. Is it possible to do a process based re-qualification of the soldering process only or would you recommend to focus on the PCA as one part of the product? The third option we see is to re-qualify the product as a whole. Each of these appear to demand different types of tests.
At the moment I am looking at it from a form, fit and function consideration (reliability element). As form and fit appear not to be impacted we consider that potentially reliability considerations come into play here. Do you have any experience or are aware of any case studies, standards or suggestions on how to approach this in a concise way?
At the moment I am looking at it from a form, fit and function consideration (reliability element). As form and fit appear not to be impacted we consider that potentially reliability considerations come into play here. Do you have any experience or are aware of any case studies, standards or suggestions on how to approach this in a concise way?