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dad23honu
Can a few failed solder joints cause my entire assembly to fail RoHS compliance? Let's say I have 400 lead-free components on a board. All were processed with lead-free paste, but some of the joints were cross-contaminated with leaded solder during touch-up. All of the components(and their accompanying solder joints) were shot with an XRF gun. Five locations failed with lead readings of 1300ppm, 2400ppm, 13,000ppm, 30,000ppm, and 153,000ppm. A few were in the yellow zone (around 950ppm), but the rest were in the None Detected through low hundreds ppm range. If I could calculate that the combined solder weight that I added to this assembly was below 1000ppm of lead, would I pass?
As I understand the RoHS directive, there must be no more than 0.1% (<1000ppm) of lead, when calculated by weight of raw homogeneous materials. Does my question make sense? If I can make the case that the combined mass of all of my solder joints (a single homogeneous material) is under 1000ppm of lead, should my assembly be considered RoHS compliant?
Or, does the failing of the "solder joints" on 5 locations make me out of compliance, when the solder joints on 395 locations are all within (or way below) spec?
As I understand the RoHS directive, there must be no more than 0.1% (<1000ppm) of lead, when calculated by weight of raw homogeneous materials. Does my question make sense? If I can make the case that the combined mass of all of my solder joints (a single homogeneous material) is under 1000ppm of lead, should my assembly be considered RoHS compliant?
Or, does the failing of the "solder joints" on 5 locations make me out of compliance, when the solder joints on 395 locations are all within (or way below) spec?